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| Name: |
Professor NN Ekere |
| Organisation: |
Liverpool John Moores University |
| Department: |
School of Engineering |
| Current EPSRC-Supported Research
Topics: |
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| Current EPSRC Support |
| There is no current EPSRC Support |
| Previous EPSRC Support |
| GR/S22332/01 | Pb-free soldering for flip chip assembly applications | (P) |
| GR/M39848/02 | R-COMPAS RAPID CONFIGURATION OF MANUFACTURING PROCESSES FOR AGILE SUPPLY-CHAINS | (P) |
| GR/N14125/02 | LEAD FREE SOLDERING FOR FLIP-CHIP ASSEMBLY APPLICATIONS | (P) |
| GR/R09206/02 | Microsystems Assembley Technology For the 21St Century - Mat21 | (P) |
| GR/R09206/01 | Microsystems Assembley Technology For the 21St Century - Mat21 | (P) |
| GR/N14125/01 | LEAD FREE SOLDERING FOR FLIP-CHIP ASSEMBLY APPLICATIONS | (P) |
| GR/M39848/01 | R-COMPAS RAPID CONFIGURATION OF MANUFACTURING PROCESSES FOR AGILE SUPPLY-CHAINS | (P) |
| GR/L66113/01 | CHIP-SCALE SOLDERING STUDIES BASED UPON THE PROCESSING OF LOW COST FLIP-CHIP ASSEMBLIES | (P) |
| GR/L59320/01 | CHARACTERISATION AND MODELLING OF THE RHEOLOGY OF SOLDER PASTES | (P) |
| GR/L20597/01 | CHARACTERISATION AND MODELLING OF THE RHEOLOGY OF SOLDER PASTES | (P) |
| GR/K76542/01 | ASPMIC: AUTOMATIC SOLDER PASTE MONITORING, INSPECTION AND CONTROL | (P) |
| GR/H39239/01 | MODELLING OF SOLDER PASTE PRINTING FOR THE REFLOW SOLDERING OF SURFACE-MOUNTED COMPONENTS | (P) |
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Key: (P)=Principal Investigator, (C)=Co-Investigator, (R)=Researcher Co-Investigator
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