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Details of Grant 

EPSRC Reference: GR/L66113/01
Title: CHIP-SCALE SOLDERING STUDIES BASED UPON THE PROCESSING OF LOW COST FLIP-CHIP ASSEMBLIES
Principal Investigator: Ekere, Professor NN
Other Investigators:
Researcher Co-Investigators:
Project Partners:
BAE Systems Celestica Ltd DEK
Mitel Multicore Solders Ltd
Department: Aeronautical & Mechanical Eng (Res Cen)
Organisation: University of Salford
Scheme: Standard Research (Pre-FEC)
Starts: 01 August 1997 Ends: 31 October 2000 Value (£): 143,916
EPSRC Research Topic Classifications:
Design & Testing Technology
EPSRC Industrial Sector Classifications:
Electronics
Related Grants:
Panel History:  
Summary on Grant Application Form
Solder paste is the primary joining medium used in the assembly of electronic devices. The technology currently available in industry can only print down to 250m, because the paste materials are not designed for deposition and reflow below the 250m limit. The research is aimed at achieving extremely fine pitch (sub 100m) flip chip interconnection at low cost by adapting existing materials to overcome current limitations. The project will study the printing of solder paste onto the flip chips, and the reflow of the paste deposit of form solder bumped flip chips. The project will also study the printing of solder paste onto low cost printed circuit boards (PCB's), the placement of the bumped flip chips, and their reflow to form solder joints between the flip chips and the PCB. And important part of this work will be the close examination of the solder joints, to ascertain the material properties which prevail at this geometric scale.
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Further Information:  
Organisation Website: http://www.salford.ac.uk