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Details of Grant 

EPSRC Reference: EP/C534212/1
Title: 3D-Mintegration: the Design and Manufacture of 3D Integrated Miniaturised Products
Principal Investigator: Desmulliez, Professor M
Other Investigators:
Ratchev, Professor SM Allen, Professor D Conway, Professor P
O'Neill, Professor W Gindy, Professor N Bailey, Professor C
Researcher Co-Investigators:
Project Partners:
Accuromm UK Ltd AstraZeneca Battenfeld U K Ltd
BCF Designs Ltd Carl Zeiss Epigem Ltd
Flomerics Ltd GlaxoSmithKline plc (GSK) Institute for System Level Integration
Microstencil Ltd Multi-Physics Software Ltd Omniscan
SPI Photonics Sun Microsystems Syngenta
Tecan Components Ltd TQC Ltd Unilever
Unipath Ltd
Department: Sch of Engineering and Physical Science
Organisation: Heriot-Watt University
Scheme: Standard Research (Pre-FEC)
Starts: 01 October 2005 Ends: 31 March 2010 Value (£): 4,166,515
EPSRC Research Topic Classifications:
Design Engineering Manufacturing Machine & Plant
Microsystems Robotics & Autonomy
EPSRC Industrial Sector Classifications:
Aerospace, Defence and Marine Electronics
Pharmaceuticals and Biotechnology
Related Grants:
Panel History:  
Summary on Grant Application Form
The miniaturisation of form and function has been an enormously strong economic driver over the last 50 years. Nowhere has this been seen more spectacularly than in the electronics industry. We are now starting to see the growth of a new economic driver based on microengineering. The first generations of products using microengineered parts are now in volume production and, although they are generally created using processes based on planar (2D) semiconductor manufacturing, and silicon, they reach out much further than electronics to encompass miniaturised mechanical, fluidic, optical, biological and chemical systems.This extraordinary progress has set companies' plans and user expectations squarely down the line of smaller, lighter, smarter products, whether they be body-worn information platforms, ingestible diagnostic and therapeutic devices, or the weaponry subsystems that may make an individual soldier as formidable as a fighting vehicle. However, at the leading edge of these exciting developments a barrier has appeared: these new products are in danger of sticking at the crafted prototype stage because the whole train of processes and philosophies demanded for their effective commercial design and manufacture does not exist.Developing true 3D design and manufacture technologies and then transferring them from the research base to become commercially viable processes is recognised as a Grand Challenge. In particular:Melding technologies that are inter- and multi- disciplinary by nature to provide the required train of economic, repeatable processes poses formidable research problems.For companies in many market sectors, remaining competitive and continuing down the smaller, lighter, smarter product trend will ultimately mean abandoning conventional design and manufacturing methods and adopting new processes and plant.The new design and manufacturing techniques envisaged by this project are expected to form the basis for next generation automotive, aerospace, telecommunications, medical and consumer products that will combine significantly improved performance with higher added value, sustainability and eco-efficiency.
Key Findings
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Organisation Website: http://www.hw.ac.uk