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Researcher Details
 
Name: Professor C Bailey
Organisation: University of Greenwich
Department: Mathematical Sciences, FACH
Current EPSRC-Supported Research Topics:
Continuum Mechanics Design Engineering
Electric Motor & Drive Systems Electronic Devices & Subsys.
Materials Characterisation Materials Processing
Materials testing & eng. Power Electronics

Current EPSRC Support
EP/R019207/1 High reliability Interconnects: New Methodologies for Lead-free Solders(P)
EP/R004390/1 Multi-Domain Virtual Prototyping Techniques for Wide-Bandgap Power Electronics(C)
EP/K035304/1 Underpinning Power Electronics 2012: Hub(C)
Previous EPSRC Support
EP/K034804/1 Underpinning Power Electronics 2012: Components Theme(C)
EP/H03014X/1 An Innovative Electronics Manufacturing Research Centre(C)
EP/D055814/1 Equipment for Physics-of-Failure and Reliability Research in Electronics(C)
EP/C534212/1 3D-Mintegration: the Design and Manufacture of 3D Integrated Miniaturised Products(C)
EP/C519108/1 An Epic Visit to China and Japan(P)
EP/C513061/1 IMRC OUTREACH: Modelling the Electrodeposition Process for MicroSystems Applications (MEMSA)(P)
GR/T07459/01 An Innovative Electronics Manufacturing Research Centre(C)
GR/S26453/01 Lead Free Soldering for Flip Chip Assembley(P)
GR/R35599/01 A New Manufacturing Process to Remove Silver from Lead(P)
GR/R09190/01 Microsystems Assembley Technology For the 21St Century - Mat21(P)
GR/N30392/01 MTP IN COMPUTATIONAL SCIENCE AND ENGINEERING FOR INDUSTRY(C)
GR/R05536/01 Computational Modelling of Engineering Processes On High Performance Clusters(C)
GR/N14095/01 LEAD FREE SOLDERING FOR FLIP-CHIP ASSEMBLY APPLICATIONS(P)
GR/N39692/01 RAIS: MODELLING SOLDER JOINT FORMATION IN THE FLIP- CHIP PROCESS(P)
GR/M09292/01 MODELLING SOLDER JOINT FORMATION IN THE FLIP-CHIP PROCESS(P)
GR/K42370/01 MULTIPHYSICS ADVANCED NUMERICAL MODELLING OF METALS CASTING PROCESSES(C)
Key: (P)=Principal Investigator, (C)=Co-Investigator, (R)=Researcher Co-Investigator