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| Name: |
Professor C Bailey |
| Organisation: |
University of Greenwich |
| Department: |
Mathematical Sciences, FACH |
| Current EPSRC-Supported Research
Topics: |
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Design & Testing Technology
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Electric Motor & Drive Systems
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Manufact. Enterprise Ops& Mgmt
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| Current EPSRC Support |
| EP/X024377/1 | Real-time Virtual Prototypes for the Power Electronics Supply Chain | (C) |
| EP/W006642/1 | Closed Loop Digitalised Data Analytics and Analysis Platform (DAAP) for Intelligent Design and Manufacturing of Power Electronic Modules | (C) |
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| Previous EPSRC Support |
| EP/R019207/1 | High reliability Interconnects: New Methodologies for Lead-free Solders | (P) |
| EP/R004390/1 | Multi-Domain Virtual Prototyping Techniques for Wide-Bandgap Power Electronics | (C) |
| EP/K035304/1 | Underpinning Power Electronics 2012: Hub | (C) |
| EP/K034804/1 | Underpinning Power Electronics 2012: Components Theme | (C) |
| EP/H03014X/1 | An Innovative Electronics Manufacturing Research Centre | (C) |
| EP/D055814/1 | Equipment for Physics-of-Failure and Reliability Research in Electronics | (C) |
| EP/C534212/1 | 3D-Mintegration: the Design and Manufacture of 3D Integrated Miniaturised Products | (C) |
| EP/C519108/1 | An Epic Visit to China and Japan | (P) |
| EP/C513061/1 | IMRC OUTREACH: Modelling the Electrodeposition Process for MicroSystems Applications (MEMSA) | (P) |
| GR/T07459/01 | An Innovative Electronics Manufacturing Research Centre | (C) |
| GR/S26453/01 | Lead Free Soldering for Flip Chip Assembley | (P) |
| GR/R35599/01 | A New Manufacturing Process to Remove Silver from Lead | (P) |
| GR/R09190/01 | Microsystems Assembley Technology For the 21St Century - Mat21 | (P) |
| GR/N30392/01 | MTP IN COMPUTATIONAL SCIENCE AND ENGINEERING FOR INDUSTRY | (C) |
| GR/R05536/01 | Computational Modelling of Engineering Processes On High Performance Clusters | (C) |
| GR/N14095/01 | LEAD FREE SOLDERING FOR FLIP-CHIP ASSEMBLY APPLICATIONS | (P) |
| GR/N39692/01 | RAIS: MODELLING SOLDER JOINT FORMATION IN THE FLIP- CHIP PROCESS | (P) |
| GR/M09292/01 | MODELLING SOLDER JOINT FORMATION IN THE FLIP-CHIP PROCESS | (P) |
| GR/K42370/01 | MULTIPHYSICS ADVANCED NUMERICAL MODELLING OF METALS CASTING PROCESSES | (C) |
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Key: (P)=Principal Investigator, (C)=Co-Investigator, (R)=Researcher Co-Investigator
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