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Researcher Details
 
Name: Professor P Conway
Organisation: Loughborough University
Department: Wolfson Sch of Mech, Elec & Manufac Eng
Current EPSRC-Supported Research Topics:
Artificial Intelligence Control Engineering
Design Engineering Electronic Devices & Subsys.
Information & Knowledge Mgmt Manufact. Enterprise Ops& Mgmt
Manufacturing Machine & Plant Manufacturing Machine & Plant
Materials Processing RF & Microwave Technology
Robotics & Autonomy

Current EPSRC Support
EP/P027482/1 Embedded Integrated Intelligent Systems for Manufacturing(C)
EP/N010493/1 SYnthesizing 3D METAmaterials for RF, microwave and THz applications (SYMETA)(C)
EP/L014998/1 EPSRC Centre for Doctoral Training in Embedded Intelligence(P)
EP/L017709/1 Sustainable Manufacturing of Transparent Conducting Oxide (TCO) Inks and Thin Films(C)
Previous EPSRC Support
EP/K018191/1 Knowledge Driven Configurable Manufacturing (KDCM)(C)
EP/K014137/1 Adaptive Informatics for Intelligent Manufacturing (AI2M)(C)
EP/J501748/1 Intelligent embedded components for enhanced supply chain observability and traceability: INTELLICO(C)
EP/I033335/2 EPSRC Centre for Innovative Manufacturing in Additive Manufacturing(C)
EP/I033335/1 EPSRC Centre for Innovative Manufacturing in Additive Manufacturing(C)
EP/H03014X/1 An Innovative Electronics Manufacturing Research Centre(P)
EP/H009744/1 ESPRIT with Pervasive Sensing (Programme Grant)(C)
EP/E002323/1 A Centre for Innovative Manufacturing and Construction(C)
EP/C534212/1 3D-Mintegration: the Design and Manufacture of 3D Integrated Miniaturised Products(C)
EP/C534247/1 Regenerative Medicine - A New Industry(C)
GR/T07459/01 An Innovative Electronics Manufacturing Research Centre(P)
GR/S87102/01 Towards an Innovative Electronics Manufacturing Research Centre(P)
GR/R72310/01 Substrates to Enable Low Cost Flip-chip and Opto-electronic Device Manufacture(C)
GR/R64483/01 A centre for innovative manufacturing and construction research(C)
GR/R18383/01 IMI: Innovation In Healthcare Combining Electronics, Drug Delivery & Information Technologies(P)
GR/M75075/01 LARGE AREA COST EFFICIENT FLEXIBLE CIRCUITS(P)
GR/M01548/01 GAAS MMIC FLIP CHIP PACKAGING FOR MILLIMETRE WAVE CONSUMER CIRCUITS(C)
GR/L61767/01 CHIP-SCALE SOLDERING STUDIES BASED ON LOW COST FLIP CHIP ASSEMBLY(P)
GR/J07167/01 MODELLING AND EXPERIMENTAL INVESTIGATION OF REFLOW SOLDERING(P)
GR/H91022/01 GLOBALISATION OF ELETRONICS MANUFACTURE - THE GROWTH OF AN ELECTRONICS MANUFACTURING INDUSTRY(C)
GR/H12898/01 TECHNOLOGY DEVELOPMENT AND EVOLUTION: ELECTRONICS PACKAGING AND INTERCONNECT(C)
Key: (P)=Principal Investigator, (C)=Co-Investigator, (R)=Researcher Co-Investigator