EP/P027482/1 | Embedded Integrated Intelligent Systems for Manufacturing | (C) |
EP/N010493/1 | SYnthesizing 3D METAmaterials for RF, microwave and THz applications (SYMETA) | (C) |
EP/L017709/1 | Sustainable Manufacturing of Transparent Conducting Oxide (TCO) Inks and Thin Films | (C) |
EP/K018191/1 | Knowledge Driven Configurable Manufacturing (KDCM) | (C) |
EP/K014137/1 | Adaptive Informatics for Intelligent Manufacturing (AI2M) | (C) |
EP/J501748/1 | Intelligent embedded components for enhanced supply chain observability and traceability: INTELLICO | (C) |
EP/I033335/2 | EPSRC Centre for Innovative Manufacturing in Additive Manufacturing | (C) |
EP/I033335/1 | EPSRC Centre for Innovative Manufacturing in Additive Manufacturing | (C) |
EP/H03014X/1 | An Innovative Electronics Manufacturing Research Centre | (P) |
EP/H009744/1 | ESPRIT with Pervasive Sensing (Programme Grant) | (C) |
EP/E002323/1 | A Centre for Innovative Manufacturing and Construction | (C) |
EP/C534212/1 | 3D-Mintegration: the Design and Manufacture of 3D Integrated Miniaturised Products | (C) |
EP/C534247/1 | Regenerative Medicine - A New Industry | (C) |
GR/T07459/01 | An Innovative Electronics Manufacturing Research Centre | (P) |
GR/S87102/01 | Towards an Innovative Electronics Manufacturing Research Centre | (P) |
GR/R72310/01 | Substrates to Enable Low Cost Flip-chip and Opto-electronic Device Manufacture | (C) |
GR/R64483/01 | A centre for innovative manufacturing and construction research | (C) |
GR/R18383/01 | IMI: Innovation In Healthcare Combining Electronics, Drug Delivery & Information Technologies | (P) |
GR/M75075/01 | LARGE AREA COST EFFICIENT FLEXIBLE CIRCUITS | (P) |
GR/M01548/01 | GAAS MMIC FLIP CHIP PACKAGING FOR MILLIMETRE WAVE CONSUMER CIRCUITS | (C) |
GR/L61767/01 | CHIP-SCALE SOLDERING STUDIES BASED ON LOW COST FLIP CHIP ASSEMBLY | (P) |
GR/J07167/01 | MODELLING AND EXPERIMENTAL INVESTIGATION OF REFLOW SOLDERING | (P) |
GR/H91022/01 | GLOBALISATION OF ELETRONICS MANUFACTURE - THE GROWTH OF AN ELECTRONICS MANUFACTURING INDUSTRY | (C) |
GR/H12898/01 | TECHNOLOGY DEVELOPMENT AND EVOLUTION: ELECTRONICS PACKAGING AND INTERCONNECT | (C) |