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Details of Grant 

EPSRC Reference: GR/T06322/01
Title: Integration of Microelectromechanical Systems (MEMS) with Electronics in Silicon Carbide for Harsh Environments
Principal Investigator: Cheung, Professor R
Other Investigators:
Walton, Professor AJ
Researcher Co-Investigators:
Dr L Jiang
Project Partners:
Case Western Reserve University Druck Ltd QinetiQ
Department: Sch of Engineering
Organisation: University of Edinburgh
Scheme: Standard Research (Pre-FEC)
Starts: 01 December 2004 Ends: 31 May 2008 Value (£): 236,244
EPSRC Research Topic Classifications:
Electronic Devices & Subsys. Microsystems
EPSRC Industrial Sector Classifications:
Aerospace, Defence and Marine Electronics
Transport Systems and Vehicles
Related Grants:
GR/T06339/01
Panel History:  
Summary on Grant Application Form
The proposed research sets out to take advantage of the excellent electrical, mechanical and chemical properties of 3C-silicon carbide (SiC) with the aim of building dynamic and static sensors integrated with electronics on a single chip module to be used in harsh environments, e.g. aerospace, gas turbine, oil industry. By combining the unique strengths in SiC MEMS and electronics design, fabrication and testing, available at the Universities of Edinburgh and Newcastle, the critical step of integration for SiC MEMS and electronics into a single chip module will be overcome - essential for bringing SiC integrated microsystems to the future market place. The development of optimised technology for the integration step is central to the proposed research. The integrated SiC MEMS to be constructed includes lateral accelerometers, pressure sensors and metal-semiconductor field effect transistors. The proposed research programme represents the first of its kind in the world. The programme's success will not only open many opportunities for integrated sensors operating at > 600C to enter the commercial market, but also will provide excellent chances for the UK to gain leadership in this area.
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