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Details of Grant 

EPSRC Reference: GR/L83882/01
Title: JREI:ADVANCED MICROELECTRONICS PACKAGING AND INTERCONNECTION
Principal Investigator: Wherrett, Professor B
Other Investigators:
Taghizadeh, Professor MR Stanley, Professor C Sangster, Professor AJ
Dhariwal, Dr R Walker, Professor A Desmulliez, Professor M
UNDERWOOD, Professor I Uttamchandani, Professor D Binnie, Dr TD
Sibbett, Professor W
Researcher Co-Investigators:
Project Partners:
European Commission (EC) Pre Nexus Migration
Department: Physics
Organisation: Heriot-Watt University
Scheme: JREI
Starts: 19 January 1998 Ends: 18 January 2001 Value (£): 82,415
EPSRC Research Topic Classifications:
Design & Testing Technology
EPSRC Industrial Sector Classifications:
No relevance to Underpinning Sectors
Related Grants:
Panel History:  
Summary on Grant Application Form
A flip-chip bonding facility will be established and used to ernhance a number of existing university projects and to enable new projects.Six programmes of work have been identified at the outset, involving academics at six Scottish Universities. Other groups have also indicated an interest in obtaining time on the machine.Topics covered are:-Novel microelectronics packaging technology where flip-chip binding is seen as the way foward for low-cost, high density packaging with high clock rates.Smart-pixel array technology, where the exploitation of optical interconnection (either via fibres or free-space) requires the interfacing of microelectronic and optoelectronic chips, offering aggregate bandwidths off-chip in excess of 1THz.Focal-plane sensor-array technology with direct bonding of the array to the Si microelectronics.Microsystems packaging, where for medical implants minimum size is essential and where precise assembly alignment is critical.Complex micro-optic arrays for optical packaging.The project builds from existing research programmes, with funding from both governmental and non-governmental sources.The technology itself is at a stage where commercial machine can be purchased, with the flexibility to address the range of materials- combinations and geometries required by the above projects. Given the opportunities for novel structures and devices this is a key time for such a machine to be made available to the UK university sector.
Key Findings
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Potential use in non-academic contexts
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Summary
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Project URL:  
Further Information:  
Organisation Website: http://www.hw.ac.uk