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Details of Grant 

EPSRC Reference: GR/S87485/01
Title: Liquid Solder Interconncts for High Temperature Applications.
Principal Investigator: Whalley, Mr D
Other Investigators:
Hutt, Dr DA
Researcher Co-Investigators:
Project Partners:
Dynex Semiconductor (CRRC Times UK) Multicore Solders Ltd Oxford Applied Technology Ltd
Schlumberger TWI Ltd
Department: Sch of Mechanical and Manufacturing Eng
Organisation: Loughborough University
Scheme: Standard Research (Pre-FEC)
Starts: 01 September 2004 Ends: 31 August 2007 Value (£): 86,326
EPSRC Research Topic Classifications:
Electronic Devices & Subsys.
EPSRC Industrial Sector Classifications:
Aerospace, Defence and Marine Electronics
Related Grants:
GR/S87478/01
Panel History:  
Summary on Grant Application Form
This proposal seeks to implement liquid solder interconnections for connecting semiconductor chips in high temperature environments. A recently completed feasibility study at KCL has answered some basic questions on materials selection and failure mechanisms for liquid phase interconnects, and this proposal seeks to develop the technology to the point where it can be implemented in industrial applications.The principle behind liquid solder interconnects is that the solder is designed to melt during high temperature excursions, releasing all stresses in the solder joint. This prevents strain hardening and crack formation in the solder joint during thermal cycling. The device is mechanically attached to the circuit board by a polymer adhesive. An additional advantage of this approach is that the solder joint metallurgy is theoretically unchanged between the first temperature cycle and the 10,000th cycle (grain coarsening will not occur).Two applications will be tackled using liquid solder technology. The first is a high power semiconductor die, which will be wirebonded using a liquid solder interconnect. The second application is a generic flip-chip assembly, which will be designed to operate reliably at temperatures up to 200C. The generic issues that will be tackled include stabilizing the solder - barrier metal interface, establishing the reliability advantages of the technique over conventional soldering, and developing models to predict failure mechanisms of liquid solder interconnections
Key Findings
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Summary
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Further Information:  
Organisation Website: http://www.lboro.ac.uk