| EPSRC Reference: |
GR/S87478/01 |
| Title: |
Liquid Solder Interconncts for High Temperature Applications. |
| Principal Investigator: |
Mannan, Professor S |
| Other Investigators: |
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| Project Partners: |
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| Department: |
Mechanical Engineering |
| Organisation: |
Kings College London |
| Scheme: |
Standard Research (Pre-FEC) |
| Starts: |
12 July 2004 |
Ends: |
11 July 2007 |
Value (£): |
204,973
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| EPSRC Research Topic Classifications: |
| Electronic Devices & Subsys. |
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| EPSRC Industrial Sector Classifications: |
| Aerospace, Defence and Marine |
Electronics |
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Summary on Grant Application Form |
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This proposal seeks to implement liquid solder interconnections for connecting semiconductor chips in high temperature environments. A recently completed feasibility study at KCL has answered some basic questions on materials selection and failure mechanisms for liquid phase interconnects, and this proposal seeks to develop the technology to the point where it can be implemented in industrial applications.The principle behind liquid solder interconnects is that the solder is designed to melt during high temperature excursions, releasing all stresses in the solder joint. This prevents strain hardening and crack formation in the solder joint during thermal cycling. The device is mechanically attached to the circuit board by a polymer adhesive. An additional advantage of this approach is that the solder joint metallurgy is theoretically unchanged between the first temperature cycle and the 10,000th cycle (grain coarsening will not occur).Two applications will be tackled using liquid solder technology. The first is an IGBT power semiconductor die, which will be 'lwirebonded using a liquid solder interconnect. The second application is a generic flip-chip assembly, which will be designed to operate reliably at temperatures up to 200C. The generic issues that will be tackled include stabilizing the solder - barrier metal interface, establishing the reliability advantages of the technique over conventional soldering, and developing models to predict failure mechanisms of liquid solder interconnections.
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Key Findings |
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This information can now be found on Gateway to Research (GtR) http://gtr.rcuk.ac.uk
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Potential use in non-academic contexts |
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This information can now be found on Gateway to Research (GtR) http://gtr.rcuk.ac.uk
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Impacts |
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| Description |
This information can now be found on Gateway to Research (GtR) http://gtr.rcuk.ac.uk |
| Summary |
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| Date Materialised |
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Sectors submitted by the Researcher |
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This information can now be found on Gateway to Research (GtR) http://gtr.rcuk.ac.uk
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| Project URL: |
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