| EPSRC Reference: |
GR/R61673/01 |
| Title: |
A novel bump transfer method for fine-pitch flip chip assembly |
| Principal Investigator: |
Wang, Dr C |
| Other Investigators: |
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| Project Partners: |
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| Department: |
Sch of Engineering and Physical Science |
| Organisation: |
Heriot-Watt University |
| Scheme: |
Fast Stream |
| Starts: |
13 May 2002 |
Ends: |
12 October 2003 |
Value (£): |
61,665
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| EPSRC Research Topic Classifications: |
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| EPSRC Industrial Sector Classifications: |
| Communications |
Electronics |
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Summary on Grant Application Form |
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The proposed project aims to investigate a low cost, efficient and lead-free chip/wafer bumping method for flip chip assembly of integrated circuit (IC) and optoelectronic chips, and other electronic and photonic devices. The new bumping method is based on a bump transfer approach, i.e. bumps/columns are first fabricated on low cost, flexible carriers, and then transferred onto a chip/wafer. The bump transfer is realised by bonding the bumps to the contact pads of chip/wafer using thermocompression gang bonding and then peeling off the flexible carrier, to be named as bond and peel technique for chip/wafer bumping. The novelty of the method lies in the fact that it allows batch fabrication of bumps and selective transfer of the bumps to IC chip/wafer in a simple, yet efficient approach. It also allows minimal processing of chip/wafer before bumping which otherwise would be detrimental to the fabricated integrated circuit and possibly reduce the yield of product manufacture.The use of copper bumps/columns fabricated using a microfabrication approach, offers lead-free, fine pitch flip chip interconnections not only to future chip-to-next-level interconnect requirements as predicted in the recent international technolgy roadmap for semiconductors, but also to many other emerging applications in a rapidly growing field of microsystems technology.
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Key Findings |
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This information can now be found on Gateway to Research (GtR) http://gtr.rcuk.ac.uk
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Potential use in non-academic contexts |
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This information can now be found on Gateway to Research (GtR) http://gtr.rcuk.ac.uk
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Impacts |
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| Description |
This information can now be found on Gateway to Research (GtR) http://gtr.rcuk.ac.uk |
| Summary |
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| Date Materialised |
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Sectors submitted by the Researcher |
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This information can now be found on Gateway to Research (GtR) http://gtr.rcuk.ac.uk
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| Project URL: |
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| Further Information: |
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| Organisation Website: |
http://www.hw.ac.uk |