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Details of Grant 

EPSRC Reference: GR/R24678/01
Title: Microfabricated Trench Etched Resonating Pressure Sensor (TERPS)
Principal Investigator: Ward, Dr M
Other Investigators:
Prewett, Professor PD
Researcher Co-Investigators:
Project Partners:
Applied Microengineering Ltd Druck Ltd European Technology for
Towers Associates
Department: Mechanical Engineering
Organisation: University of Birmingham
Scheme: LINK
Starts: 01 September 2001 Ends: 31 August 2004 Value (£): 126,960
EPSRC Research Topic Classifications:
Instrumentation Eng. & Dev. Microsystems
EPSRC Industrial Sector Classifications:
Aerospace, Defence and Marine Manufacturing
Related Grants:
Panel History:  
Summary on Grant Application Form
We propose to develop a range of high precision resonant silicon pressure sensors. The project will be all embracing considering fundamental non linear mechanical design to manufacturing processes, The following key elements are included 1) The effect of the inherent non-linearities in tree resonant structure and the response to environmental effects such as shock, vibration, thermal cycling etc. 2) The mechanical stability of the complete packaged sensor system, including bond joints etc. 3) The design optimisation of the DRIE process. DRIE etching is emerging as a standard micro-engineering process, however the resonators considered in this study will push the technology to the limit in terms machining and reproducibility. 4) Second order effects will need to be controlled if a high performance is to be achieved. The accuracy of the deep trench etched features and of the alignment of bonded wafers. 5)The design of a resonator for the differential pressure sensor that Is contained in an evacuated cavity strong enough to withstand the high line pressure.The key missing process step (2 above , will be developed, is fusion bonding with alignment, and, in the process, to form Sealed evacuated cavities.
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Organisation Website: http://www.bham.ac.uk