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Details of Grant 

EPSRC Reference: GR/R00500/01
Title: Optimisation of Thermistor Performance Through Local Property Analysis
Principal Investigator: Leach, Dr C
Other Investigators:
Freer, Professor R
Researcher Co-Investigators:
Project Partners:
Spirent Components Ltd
Department: Materials
Organisation: University of Manchester, The
Scheme: Standard Research (Pre-FEC)
Starts: 01 April 2001 Ends: 31 December 2004 Value (£): 218,014
EPSRC Research Topic Classifications:
Electronic Devices & Subsys. Materials Characterisation
Materials Processing
EPSRC Industrial Sector Classifications:
Electronics
Related Grants:
Panel History:
Panel DatePanel NameOutcome
20 Jul 2000 Electronics/Electronic Materials Panel Deferred
Summary on Grant Application Form
We wish to study the electrical structure of individual grain boundaries in PTC thermistors, using SEM based hot stage conductive mode microscopy techniques complemented by the development of localised AC impedance and low temperature conductivity measurements. This will be correlated with detailed crystallographic and compositional studies of the interfaces and used to address issues concerned with the processing and application of positive temperature coefficient (PTC) thermistors, such as in-service failure and minimisation of the pellet resistance below the Curie temperature.We propose to extend the model for the behaviour of thermistor grain boundaries, taking into account terms specific to individual interfaces, including the form of the PTC curve, segregation of dopants, alloying elements and impurities, grain boundary structure (misorientation and plane), local crystallographic effects including domain texture, trap levels, capacitance and dielectric constant variations as a function of temperature. The overall performance of commercial thermistors, particularly during the transient heating phase, along with stresses induced by thermal, piezo- and domain effects, will be modelled by finite element techniques. We will do this by considering the performance of individual grain boundary structures and small networks of interfaces, and integrating these data over the whole device.
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Organisation Website: http://www.man.ac.uk