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Details of Grant 

EPSRC Reference: GR/N39692/01
Title: RAIS: MODELLING SOLDER JOINT FORMATION IN THE FLIP- CHIP PROCESS
Principal Investigator: Bailey, Professor C
Other Investigators:
Researcher Co-Investigators:
Project Partners:
Celestica Ltd
Department: Sch of Computing and Maths Sci
Organisation: University of Greenwich
Scheme: Standard Research (Pre-FEC)
Starts: 01 April 2000 Ends: 31 March 2001 Value (£): 21,874
EPSRC Research Topic Classifications:
Multimedia
EPSRC Industrial Sector Classifications:
R&D
Related Grants:
Panel History:  
Summary on Grant Application Form
This programme will develop details models representing the formation of solder joints from solder paste, consisting of solder pellets and a fluxing agent. Major effort will be spent on developing models for Solder-Flux reactions, voidage formation, and intermetallic formation. Using the multiphysics framework, PHYSICA, these models will be integrated into state-of-the-art integrated modelling technology for solidification and stress.The developed models will be validated using data from our collaborators. These models will then be used to help identify optimal process routes for flip-chip technology using current assembly techniques.
Key Findings
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Summary
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Organisation Website: http://www.gre.ac.uk