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Details of Grant 

EPSRC Reference: GR/N14095/01
Title: LEAD FREE SOLDERING FOR FLIP-CHIP ASSEMBLY APPLICATIONS
Principal Investigator: Bailey, Professor C
Other Investigators:
Researcher Co-Investigators:
Project Partners:
Celestica Ltd Itri Ltd MBDA
Multicore Solders Ltd
Department: Sch of Computing and Maths Sci
Organisation: University of Greenwich
Scheme: Standard Research (Pre-FEC)
Starts: 01 April 2000 Ends: 30 September 2002 Value (£): 110,172
EPSRC Research Topic Classifications:
Materials Characterisation Materials testing & eng.
EPSRC Industrial Sector Classifications:
Aerospace, Defence and Marine Electronics
Related Grants:
Panel History:  
Summary on Grant Application Form
The project will be centred on providing the understanding of the formation and assembly of flip-chip solder joints using chips produced with the newly developed copper bumping technique, lead-free solder alloy and low-cost processes compatible with conventional PCBs. A combination of new and developing solder paste printing and lead-free soldering techniques will be used to form flip-chip assemblies at the sub-100um pitch (which is far smaller than the 200-250um pitch currently achievable). The project will investigate, using both experimental and modelling the performance of lead-free solder materials in the assembly of flip-chips, solder joint formation and the reliability of the joint and assembly. The knowledge gained will be used for predicting dissolution at the solder interfaces and segregation in the solder which may lead to intermetallic formation and growth and other defects such as solder lifting and voiding. The project will recommend the complete process routes for flip-chip assembly using copper bumped chips and lead-free soldering.
Key Findings
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Summary
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Organisation Website: http://www.gre.ac.uk