| EPSRC Reference: |
GR/M39220/01 |
| Title: |
INFLUENCE OF CONTAMINATION ON THE LONG-TERM RELIABILITY OF CHIP-ON-BOARD (COB) TECHNOLOGY |
| Principal Investigator: |
Cordery, Dr A |
| Other Investigators: |
|
| Researcher Co-Investigators: |
|
| Project Partners: |
|
| Department: |
Faculty of Technology, Design and Enviro |
| Organisation: |
Oxford Brookes University |
| Scheme: |
Standard Research (Pre-FEC) |
| Starts: |
01 November 1998 |
Ends: |
28 February 2002 |
Value (£): |
154,987
|
| EPSRC Research Topic Classifications: |
| Design & Testing Technology |
|
|
| EPSRC Industrial Sector Classifications: |
|
| Related Grants: |
|
| Panel History: |
|
|
Summary on Grant Application Form |
|
Attaching the semiconductor die directly to the printed circuit board (Chip-on-Board (COB) technology) without using a package saves cost, weight, and space and also improves electrical performance. However there are some serious problems associated with this technology, which have prevented it from becoming mainstream. One of the unresolved issues is the possibility of contaminating the die during assembly, either from the ambient or from the processing materials (underfill, flux, board). This proposal concerns a systematic investigation of the effect of possible contamination on the long-term integrity of the die. The outcome is to produce guidelines on contamination prevention practices. Initially all potential contamination sources will be identified. In addition the electrical parameters that can detect different failure modes must be identified. The subsequent experimental work will involve varying the contamination levels in the processing materials and assembly environment to ascertain the acceptable level of contamination. This can be achieved by comparing the electrical parameters of devices particularly sensitive to contamination before assembly, immediately after assembly and after a series of burn-in procedures. The experimental results will be analysed to assess the long-term reliability issues and predict circuit performance. Finally guidelines for material selection and proper contamination practice will be produced.Keywords describing areas of proposal Electronics, Manufacturing, Chip-on-board, Devices, Materials, Reliability, Contamination, Assembly
|
|
Key Findings |
|
This information can now be found on Gateway to Research (GtR) http://gtr.rcuk.ac.uk
|
|
Potential use in non-academic contexts |
|
This information can now be found on Gateway to Research (GtR) http://gtr.rcuk.ac.uk
|
|
Impacts |
|
| Description |
This information can now be found on Gateway to Research (GtR) http://gtr.rcuk.ac.uk |
| Summary |
|
| Date Materialised |
|
|
|
|
Sectors submitted by the Researcher |
|
This information can now be found on Gateway to Research (GtR) http://gtr.rcuk.ac.uk
|
| Project URL: |
|
| Further Information: |
|
| Organisation Website: |
http://www.brookes.ac.uk |