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Details of Grant 

EPSRC Reference: GR/M01326/01
Title: 75-300 GHZ MULTI-CHIP MODULE TECHNOLOGY
Principal Investigator: Thayne, Professor I
Other Investigators:
Beaumont, Professor S Beaumont, Professor S
Researcher Co-Investigators:
Project Partners:
Mitel Pre Nexus Migration
Department: Electronics and Electrical Engineering
Organisation: University of Glasgow
Scheme: Standard Research (Pre-FEC)
Starts: 01 July 1998 Ends: 30 June 2001 Value (£): 226,261
EPSRC Research Topic Classifications:
Design & Testing Technology
EPSRC Industrial Sector Classifications:
Electronics
Related Grants:
Panel History:  
Summary on Grant Application Form
Automotive collision avoidance systems and radiometric imaging are two applications of technologies working in the terahertz region beyond 75 GHz. The importance of these applications warrants the development of manufacturable multi-chip module (MCM) technologies that exhibits state of the art performance above 75 GHz without compromising on yield.To be successful, the MCM technologies should be compatible with standard semiconductor foundary processing techniques so that the potential for swift industrial exploitation is maximised. In this collaborative programme with the Universities of Surrey and Kent and Kings College, Glasgow will develop a novel side-contact via-hole bump process to enable InP MMICs to be electrically addressed once they are inserted into metal-pipe dielectric filled rectangular waveguides produced by Surrey. The novel contacting technique will extend the existing Glasgow InP HEMT process which has been chosen to enable demonstrators to be produced at both 77 GHz and 140 GHz (to address the applications mentioned above).Further, Glasgow will provide 67-110 GHZ on-wafer characterisation and model extraction of both passive and active devices to enable the design of the demonstrator MMICs (at Surrey, Kings ad Kent).Finally, Glasgow will fabricate the 77 GHz and 140 GHz MMICs required for the system demonstrators.
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Organisation Website: http://www.gla.ac.uk