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Details of Grant 

EPSRC Reference: GR/L99807/01
Title: VIA AND EMBEDDED RESISTOR FORMATION IN LOW COST SUBSTRATES
Principal Investigator: Harrison, Professor D
Other Investigators:
Researcher Co-Investigators:
Project Partners:
Exitech Ltd Pre Nexus Migration
Department: Design
Organisation: Brunel University London
Scheme: Standard Research (Pre-FEC)
Starts: 01 January 1998 Ends: 30 June 1999 Value (£): 9,764
EPSRC Research Topic Classifications:
Design & Testing Technology
EPSRC Industrial Sector Classifications:
Electronics
Related Grants:
Panel History:  
Summary on Grant Application Form
The technique of lithographically printing circuit substrates on paper and paper-like materials has recently been established at Brunel. However, existing techniques for the formation of vias to connect the upper and lower surfaces of a substrate are not commercially attractive. The proposed research will consider two possible solutions to this problem. In the first method a laser will be used to form holes in the substrate which may then be filled with conductive ink. The second approach will be used to melt the substrate material so that it flows together with the conductive link when re-solidification occurs. The project will also investigate the potential of these techniques for the formation of embedded resistors, either by filling laser drilled holes with resistance ink or by allowing limited mixing of conductive ink and substrate material. In order to achieve these goals an understanding of the interaction between the laser and the substrate and ink must be established, along with an understanding of the way in which the properties of the structures formed affect their performance as vias or resistors. This understanding will allow the operating parameters required for commercial realisations of the techniques to be established.
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Further Information:  
Organisation Website: http://www.brunel.ac.uk