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Details of Grant 

EPSRC Reference: GR/K71424/01
Title: MODELLING OF SOLDER JOINT RELIABILITY FOR ELECTRONIC INTERCONNECTS
Principal Investigator: Wallach, Dr ER
Other Investigators:
Researcher Co-Investigators:
Project Partners:
Multicore Solders Ltd Nortel
Department: Materials Science & Metallurgy
Organisation: University of Cambridge
Scheme: Standard Research (Pre-FEC)
Starts: 18 March 1996 Ends: 17 September 1999 Value (£): 195,000
EPSRC Research Topic Classifications:
Design & Testing Technology
EPSRC Industrial Sector Classifications:
Electronics
Related Grants:
Panel History:  
Summary on Grant Application Form
The aim of the research is to facilitate the development of both electronic devices and new solders by being able to predict, using computer simulation, the real life behaviour of soldered joints in area-array devices. The ability to investigate rapidly the effects of altering materials, geometries of joints, fabrication methods and operating conditions woul facilitate the development of new devices of higher reliability, smaller size and lower cost. Moreover, assurance can be given to the market that the new designs and materials will provide the long service lifetimes demanded commercially.Finite element analysis will be used to predict the strains that occur within solder joints due to thermal cycling; the data then will be combined with models of interactive fatigue-creep in order to predict lifetimes under given operational conditions. Simple experimental measurements will be an essential part of the programme in order to show the validity of the approach. An assessment of new solders will also be included since alternative alloys are being sought to replace currently used eutectic lead-tin solders.
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Organisation Website: http://www.cam.ac.uk