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Details of Grant 

EPSRC Reference: GR/K70137/01
Title: 3-D PACKAGING OF HETEROGENEOUS MICROSYSTEMS
Principal Investigator: Ivey, Professor P
Other Investigators:
Seed, Dr NL
Researcher Co-Investigators:
Project Partners:
Nortel Pre Nexus Migration
Department: Electronic and Electrical Engineering
Organisation: University of Sheffield
Scheme: Standard Research (Pre-FEC)
Starts: 01 October 1995 Ends: 30 September 1998 Value (£): 288,148
EPSRC Research Topic Classifications:
Design & Testing Technology
EPSRC Industrial Sector Classifications:
Communications Electronics
Creative Industries
Related Grants:
Panel History:  
Summary on Grant Application Form
This project will extend the research into the existing problem areas of the 3-D packaging technology through mechanical and physical system modelling and evaluation. This will include extension of the TRIMOD (ESPRIT 6490) MCM-V technology utilising proven microtrace substrates; and larger, more densely packed substrates and alternative interconnection strategies. The partitioning of designs across MCM-Vs will be considered and the automated routing tools necessary to implement MCM-Vs will be investigated as an extension to Cadence Allegro-MCM. The issues of hardware/software co-design will be considered - specifically with regard to the architectures required for flexible FPGA based co-processors/algorithmic accelerators - and an FPGA based MCM-V system will be implemented (possibly in a PCMCIA type III format) to demonstrate and prove the versatility and utility of the technology. The project will be undertaken in collaboration with a number of partners: Hybrid Memory Products Ltd (a TRIMOD partner) who have a commercial interest in pursing dense packaging (mainly for memory applications); Cadence Design Systems Ltd who have a commercial interest in advanced design automation tools, and BNR Europe Ltd who have an interest in evaluating packaging technologies and FPGA based sub-systems.
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Further Information:  
Organisation Website: http://www.shef.ac.uk