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Details of Grant 

EPSRC Reference: GR/J78457/01
Title: FORMATION OF ALUMINIUM PLUGS USING A TEMPERATURE DEPENDENT STRESS RELIEVING MECHANISM
Principal Investigator: UNDERWOOD, Professor I
Other Investigators:
Reeves, Dr C Vass, Professor D Walton, Professor AJ
Gundlach, Mr A
Researcher Co-Investigators:
Project Partners:
Department: Sch of Engineering
Organisation: University of Edinburgh
Scheme: Standard Research (Pre-FEC)
Starts: 22 September 1994 Ends: 21 March 1996 Value (£): 65,434
EPSRC Research Topic Classifications:
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Summary on Grant Application Form
To characterise and evaluate a novel technique for filling via holes in integrated circuits by identifying and characterising the parameters which affect the properties of the filled vias.Progress:A set of reticles has been designed containing the data required to produce the first test wafer. This contains arrays of vias of various sizes and separations. Several wafers have been fabricated. Optical evaluation of via filling on these wafers is currently underway.
Key Findings
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Summary
Date Materialised
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Organisation Website: http://www.ed.ac.uk