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Details of Grant 

EPSRC Reference: GR/A10994/01
Title: METAMORPHIC GAAS HEMTS FOR HIGH BANDWIDTH WIRELESS COM MUNICATION
Principal Investigator: Thayne, Dr I
Other Investigators:
Researcher Co-Investigators:
Project Partners:
Department: Electronics and Electrical Engineering
Organisation: University of Glasgow
Scheme: Advanced Fellowship (Pre-FEC)
Starts: 01 October 2001 Ends: 30 September 2006 Value (£): 243,888
EPSRC Research Topic Classifications:
RF & Microwave Technology
EPSRC Industrial Sector Classifications:
Related Grants:
Panel History:
Panel DatePanel NameOutcome
11 Jan 2001 IT Advanced Fellowship Interview Panel Deferred
07 Dec 2000 IT Fellowship Sift Panel Deferred
Summary on Grant Application Form
This work is centred around the optimisation of metamorphic GaAs HEMTs for millimetre-wave applications which include 40 Gbit (and beyond) optical fibre links, broadband point to (multi)point wireless distribution, fibre radio, automotive collision avoidance radar and radiometric imaging systems. Exploitation of these markets, predicted to be worth $8 billion by 2003, will require low cost, high volume, manufacturable components with operating frequencies in the range 40-200 GHz to be produced with high yield and reliability. Metamorphic GaAs HEMTs are attractive millimetre-wave devices as they combine the highest performance InP-like material structures with the manufacturability and economies of scaled offered by GaAs technology. A core focus of this work will be a detailed investigation of the impact of device vertical architecture on the performance of millimetre-wave low noise amplifiers, power amplifiers, oscillators and mixers. The metamorphic GaAs HEMT structure allows, for the first time, channel strain to be included as a design parameter. Given the influence strain plays in metamorphic GaAs HEMTs, reliability issues will be investigated as part of the optimisation process. The development of circuit demonstrators will also be used as a vehicle to drive collaborative programmes in the areas of millimetre-wave component packaging and the development of baseband DSP chips to enable Tbit wireless communications. These strands will be combined in the latter stages of the project to demonstrate a Tbit wireless link.
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Organisation Website: http://www.gla.ac.uk