| EPSRC Reference: |
GR/R93865/01 |
| Title: |
ROPA: Quality and reliability testing of BGA and flip-chip solder bonds subjected to mixed-environments using AMI |
| Principal Investigator: |
Harvey, Professor D |
| Other Investigators: |
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| Researcher Co-Investigators: |
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| Project Partners: |
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| Department: |
Engineering Tech and Maritime Operations |
| Organisation: |
Liverpool John Moores University |
| Scheme: |
ROPA |
| Starts: |
01 April 2003 |
Ends: |
30 June 2004 |
Value (£): |
51,568
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| EPSRC Research Topic Classifications: |
| Design & Testing Technology |
Electronic Devices & Subsys. |
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| Panel History: |
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Summary on Grant Application Form |
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The proposed research into Acoustic Micro Imaging (AMI) of hidden solder bonds for BGAs and flip-chips presents an opportunity for the UK to lead in the 3-D imaging of modern manufactured electronic PCBs.The proposed research into Mixed Environmental Reliability Testing (MERT) is a new idea for exposing manufactured samples to a wide range of test parameter changes simultaneously.The proposed marriage of the two methods will allow an investigation into the quality and reliability of hidden solder bonds, in modern electronic PCBs, and indicate possible routes to failure.Technical feasibility of the methods will be justified through this investigation.
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Key Findings |
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This information can now be found on Gateway to Research (GtR) http://gtr.rcuk.ac.uk
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Potential use in non-academic contexts |
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This information can now be found on Gateway to Research (GtR) http://gtr.rcuk.ac.uk
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Impacts |
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| Description |
This information can now be found on Gateway to Research (GtR) http://gtr.rcuk.ac.uk |
| Summary |
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| Date Materialised |
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Sectors submitted by the Researcher |
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This information can now be found on Gateway to Research (GtR) http://gtr.rcuk.ac.uk
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| Project URL: |
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| Further Information: |
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| Organisation Website: |
http://www.livjm.ac.uk |