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Details of Grant 

EPSRC Reference: GR/R45024/01
Title: Laser processing of electronics circuit board substrates
Principal Investigator: Hall, Professor D
Other Investigators:
Baker, Professor HJ Hand, Professor D
Researcher Co-Investigators:
Project Partners:
CoorsTek Ltd Exitech Ltd Graphic Plc
Rofin Sinar
Department: Sch of Engineering and Physical Science
Organisation: Heriot-Watt University
Scheme: Standard Research (Pre-FEC)
Starts: 01 July 2001 Ends: 31 March 2003 Value (£): 356,049
EPSRC Research Topic Classifications:
Materials testing & eng.
EPSRC Industrial Sector Classifications:
Manufacturing Electronics
Related Grants:
Panel History:  
Summary on Grant Application Form
The proposed research addresses fundamental and applied aspects of the interaction of laser radiation with key engineering materials used in advanced electronics maufacturing technology. The research will concentrate on laser generated feature sizes in the approximate range 1-300 microns in dielectrics including organic microvia substrates, ceramics and glasses, aiming to produce new basic process knowledge and increased understanding of material removal mechanisms, relevant to future electronics packaging and other precision engineering requirements. A selection of lasers including C02 (with newlyavailable relevant beam parameters), CO and Nd:YAG, capable of producing a range of beam characteristics in terms off wavelength (spanning UV to the mid IR -10 microns), peak power, pulse duration and focussed spot size will be integrated into a custom workstation, which incorporate beam and workpiece motion, high speed videography, process diagnostics and measurement capability. In addition, laser beam shaping techniques will be developed to optimise process parameters. This hardware will facilitate the investigation of basic laser/material interaction mechanisms in a well-instrumented environment. The experimental work will be linked to theoretical process modelling research undertaken by academic collaborators, with the aim of producing optimised materialdependednt processing regimes relevant to the particular requirements of drilling, scribing, cutting and marking.
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Project URL:  
Further Information:  
Organisation Website: http://www.hw.ac.uk