EPSRC Reference: |
GR/M51604/01 |
Title: |
ACME - AL TO CU METALLIZATION FOR IMPROVED RELIABILITY OF DEEP SUB-MICRON LINES AND VIAS |
Principal Investigator: |
Greer, Professor AL |
Other Investigators: |
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Researcher Co-Investigators: |
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Project Partners: |
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Department: |
Materials Science & Metallurgy |
Organisation: |
University of Cambridge |
Scheme: |
Standard Research (Pre-FEC) |
Starts: |
16 August 1999 |
Ends: |
15 February 2003 |
Value (£): |
179,624
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EPSRC Research Topic Classifications: |
Electronic Devices & Subsys. |
System on Chip |
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EPSRC Industrial Sector Classifications: |
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Related Grants: |
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Panel History: |
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Summary on Grant Application Form |
Major challenges face the microelectronics fabrication community in back-end-of-line (BEOL) processing, with the need to improve interconnect delay times and reliability as dimensions are aggressively reduced. A key new approach is the replacement of A1 metallisation by Cu, with lines made by the damascene process and chemical mechanical polishing (CMP). However, damascene + CMP can also be applied to A1 lines, and together with innovative alloying may effect improvements; in some cases damascene A1 may be preferable to Cu-a familiar material and less need for barriers. Damascene + CMP are barely represented in the UK research community and process development in that community is now overdue if key issues are to be addressed. In multilevel metallisation, vias' reliability is crucial; dual damascene and pressure-filling are options, which need to be explored. With Cu, diffusion barriers are essential and studies of their effectiveness are needed. The collaborators in this project have experience of process development and quantification of interconnect damage through microscopy and electrical measurement. Their combination of expertise will be directed towards making test structures of damascene A1 or Cu lines with innovative via-filling, and assessing their reliability against electromigration, stress voiding and contact and barrier degradation.
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Key Findings |
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Potential use in non-academic contexts |
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Impacts |
Description |
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Summary |
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Date Materialised |
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Sectors submitted by the Researcher |
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Project URL: |
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Further Information: |
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Organisation Website: |
http://www.cam.ac.uk |