EPSRC Reference: |
GR/L66113/01 |
Title: |
CHIP-SCALE SOLDERING STUDIES BASED UPON THE PROCESSING OF LOW COST FLIP-CHIP ASSEMBLIES |
Principal Investigator: |
Ekere, Professor NN |
Other Investigators: |
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Researcher Co-Investigators: |
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Project Partners: |
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Department: |
Aeronautical & Mechanical Eng (Res Cen) |
Organisation: |
University of Salford |
Scheme: |
Standard Research (Pre-FEC) |
Starts: |
01 August 1997 |
Ends: |
31 October 2000 |
Value (£): |
143,916
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EPSRC Research Topic Classifications: |
Design & Testing Technology |
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EPSRC Industrial Sector Classifications: |
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Related Grants: |
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Panel History: |
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Summary on Grant Application Form |
Solder paste is the primary joining medium used in the assembly of electronic devices. The technology currently available in industry can only print down to 250m, because the paste materials are not designed for deposition and reflow below the 250m limit. The research is aimed at achieving extremely fine pitch (sub 100m) flip chip interconnection at low cost by adapting existing materials to overcome current limitations. The project will study the printing of solder paste onto the flip chips, and the reflow of the paste deposit of form solder bumped flip chips. The project will also study the printing of solder paste onto low cost printed circuit boards (PCB's), the placement of the bumped flip chips, and their reflow to form solder joints between the flip chips and the PCB. And important part of this work will be the close examination of the solder joints, to ascertain the material properties which prevail at this geometric scale.
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Key Findings |
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Potential use in non-academic contexts |
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Impacts |
Description |
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Summary |
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Date Materialised |
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Sectors submitted by the Researcher |
This information can now be found on Gateway to Research (GtR) http://gtr.rcuk.ac.uk
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Project URL: |
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Further Information: |
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Organisation Website: |
http://www.salford.ac.uk |