EPSRC Reference: |
GR/L28128/01 |
Title: |
RELIABILITY DESIGN FOR ULTRA-SHORT-GATE CMOS TECHNOLOGIES |
Principal Investigator: |
Kelsall, Professor RW |
Other Investigators: |
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Researcher Co-Investigators: |
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Project Partners: |
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Department: |
Electronic and Electrical Engineering |
Organisation: |
University of Leeds |
Scheme: |
Standard Research (Pre-FEC) |
Starts: |
01 September 1997 |
Ends: |
31 August 2000 |
Value (£): |
118,086
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EPSRC Research Topic Classifications: |
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EPSRC Industrial Sector Classifications: |
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Related Grants: |
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Panel History: |
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Summary on Grant Application Form |
The silicon MOSFET is the basic 'building block' of the majority of integrated circuits, including VLSI memory chips and ASICs. The operating characteristics of a MOSFET deteriorate during its lifetime, dependent on the electrical stress experienced. Eventually, the MOSFET ceases to operate within its intended specification; this behaviour, repeated in even a small fraction of FETs in a chip, can lead to unreliability or complete failure. In short-gate device (which offer higher speeds and integration densities) the electrical stresses are greater, leading to accelerated degradation. Progress to ultra-small feature sizes in CMOS will be critically dependent on the ability to 'design out' degradation at the device level. The aims of the project are, by a combination of advanced theoretical and experimental techniques, to gain a detailed understanding of the physical mechanisms of hot-electron-induced degradation of ultra-short-gate-devices. This understanding will then be used to develop an accurate ageing simulator for ULSI CMOS design. Alternative FET gate dielectric materials will also be investigated in the quest for improved device reliability.
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Key Findings |
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Potential use in non-academic contexts |
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Impacts |
Description |
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Summary |
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Date Materialised |
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Sectors submitted by the Researcher |
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Project URL: |
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Further Information: |
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Organisation Website: |
http://www.leeds.ac.uk |