Details of Grant 

EPSRC Reference:	GR/J10679/01
Title:	HIGH RESOLUTION THERMO-OPTICAL INSPECTION OF THE ASSEMBLY AND FUNCTION OF INTELLIGENT POWER MODULES
Principal Investigator:	Pycock, Mr D
Other Investigators:	Webb, Dr P Evans, Professor P Quigley, Dr SF
Researcher Co-Investigators:
Project Partners:
Department:	Electronic, Electrical and Computer Eng
Organisation:	University of Birmingham
Scheme:	Standard Research (Pre-FEC)
Starts:	02 August 1993	Ends:	01 November 1996	Value (£):	230,458
EPSRC Research Topic Classifications:	Optical Communications Power Electronics
EPSRC Industrial Sector Classifications:	Electronics
Related Grants:
Panel History:
Summary on Grant Application Form
Work on the development of intelligent power modules under a separately funded project has the potential to revolutionise production methods for power electronics circuits and systems. The proposed programme of work will investigate novel high resolution thermo-optical methods of assembly inspection. The aim is to enhance the resolution of thermal image data with the aid of data from corresponding optical images. The enhanced resolution will be used to assess circuit module function using thermal time sequence signatures. The combination of optical and high resolution thermal image data will be used to assess the integrity of ultrasonic wire bonds and to provide diagnostic data to help maintain the optimal adjustment of assembly equipment especially the ultrasonic wire bonding systems.
Key Findings
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Potential use in non-academic contexts
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Project URL:
Further Information:
Organisation Website:	http://www.bham.ac.uk