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Details of Grant 

EPSRC Reference: EP/M002519/1
Principal Investigator: Dahiya, Professor R
Other Investigators:
Researcher Co-Investigators:
Project Partners:
Bruno Kessler Foundation FBK Gold Standard Simulations
Department: School of Engineering
Organisation: University of Glasgow
Scheme: First Grant - Revised 2009
Starts: 31 December 2014 Ends: 30 December 2016 Value (£): 97,910
EPSRC Research Topic Classifications:
Electronic Devices & Subsys.
EPSRC Industrial Sector Classifications:
Related Grants:
Panel History:
Panel DatePanel NameOutcome
17 Jul 2014 EPSRC ICT Prioritisation Panel - July 2014 Announced
03 Jun 2014 EPSRC ICT Responsive Mode - June 2014 Deferred
Summary on Grant Application Form
Largely driven by material scientists, the flexible electronic research thus far has focussed on the materials and fabrication techniques. Whilst these are important areas, device modelling and circuit design is critical for taking the research closer to manufacturing. The acceptable degree of bendability for reliable operation of devices and circuits is a question that has not been addressed so far. This is a challenging because the standard transistor models for circuit simulation programs such as SPICE do not take into account the dynamic bendability induced effects. FLEXELDEMO will address these challenges by systematically characterizing the ultra-thin chips, identifying various parameters that change with bending, and suggesting improved BSIM models for devices over bendable substrates.

This project has several anticipated benefits over a range of time-scales. In the short-term, this project will substantially improve our understanding of changes in various device parameters as a result of bending (uni-axial, bi-axial or twisting etc.), which has traditionally been under-studied. In the medium-term, it will enable designing of electronics on bendable substrate and predicting the behaviour of bendable electronics just like we do currently for planar electronics. In the long-term, the project will lead to intelligent use of bendability in improving circuit design. For example, location or shape dependent strain-field variations will be used to design location-/shape-aware circuits or to compensate electronic artefacts (e.g. self-calibration). The approach could also lead to design on bendable electronics based on ensemble of nanowires.

Formulating the design rules and integration strategies through modelling will help in stabilizing the nascent flexible electronics technology. By adequately supporting the fabrication activities with modelling and simulation, this project will add significant new perspective to the fields of flexible electronics and electronics design.

Key Findings
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Potential use in non-academic contexts
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Date Materialised
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Organisation Website: http://www.gla.ac.uk