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Details of Grant 

EPSRC Reference: GR/M01548/01
Title: GAAS MMIC FLIP CHIP PACKAGING FOR MILLIMETRE WAVE CONSUMER CIRCUITS
Principal Investigator: Linton, Dr D
Other Investigators:
Conway, Professor P Fusco, Professor V
Researcher Co-Investigators:
Project Partners:
Pre Nexus Migration
Department: Sch of Electronics, Elec Eng & Comp Sci
Organisation: Queen's University of Belfast
Scheme: Standard Research (Pre-FEC)
Starts: 01 August 1998 Ends: 30 April 2002 Value (£): 337,764
EPSRC Research Topic Classifications:
Design & Testing Technology
EPSRC Industrial Sector Classifications:
Electronics
Related Grants:
Panel History:  
Summary on Grant Application Form
Low cost, reliable flip chip technology applied to millimetre wave packaging of GaAs MMIC devies on softboard substrates will be researched in consultation with the flip chip development at Loughborough. Novel circuit models for the flip chip bump and coupling between the GaAs MMIC and the substrate will be examined using simulations validated using measurement at frequencies up to 85 GHz. Electromagnetic resonances and coupling between the inverted MMIC and the substrate will be characterised. The process of bumping GaAs MMICs will be developed offering high yield and low cost. Heat dissipation in a flip chip device at millimetre wave frequencies will be addressed using extra non electrical bumps as required to function as heat pipes. A demonstrator will be constructed to test the technology in a commercial application. The MMIC design expertise at QUB will be used to link the manufacturing process for chip interconnect and study the impact of process tolerance on functional performance.
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Organisation Website: http://www.qub.ac.uk