| EPSRC Reference: |
GR/J78457/01 |
| Title: |
FORMATION OF ALUMINIUM PLUGS USING A TEMPERATURE DEPENDENT STRESS RELIEVING MECHANISM |
| Principal Investigator: |
UNDERWOOD, Professor I |
| Other Investigators: |
|
| Researcher Co-Investigators: |
|
| Project Partners: |
|
| Department: |
Sch of Engineering |
| Organisation: |
University of Edinburgh |
| Scheme: |
Standard Research (Pre-FEC) |
| Starts: |
22 September 1994 |
Ends: |
21 March 1996 |
Value (£): |
65,434
|
| EPSRC Research Topic Classifications: |
|
| EPSRC Industrial Sector Classifications: |
|
| Related Grants: |
|
| Panel History: |
|
|
Summary on Grant Application Form |
|
To characterise and evaluate a novel technique for filling via holes in integrated circuits by identifying and characterising the parameters which affect the properties of the filled vias.Progress:A set of reticles has been designed containing the data required to produce the first test wafer. This contains arrays of vias of various sizes and separations. Several wafers have been fabricated. Optical evaluation of via filling on these wafers is currently underway.
|
|
Key Findings |
|
This information can now be found on Gateway to Research (GtR) http://gtr.rcuk.ac.uk
|
|
Potential use in non-academic contexts |
|
This information can now be found on Gateway to Research (GtR) http://gtr.rcuk.ac.uk
|
|
Impacts |
|
| Description |
This information can now be found on Gateway to Research (GtR) http://gtr.rcuk.ac.uk |
| Summary |
|
| Date Materialised |
|
|
|
|
Sectors submitted by the Researcher |
|
This information can now be found on Gateway to Research (GtR) http://gtr.rcuk.ac.uk
|
| Project URL: |
|
| Further Information: |
|
| Organisation Website: |
http://www.ed.ac.uk |